JPH0810186Y2 - チップマウント装置 - Google Patents

チップマウント装置

Info

Publication number
JPH0810186Y2
JPH0810186Y2 JP5927589U JP5927589U JPH0810186Y2 JP H0810186 Y2 JPH0810186 Y2 JP H0810186Y2 JP 5927589 U JP5927589 U JP 5927589U JP 5927589 U JP5927589 U JP 5927589U JP H0810186 Y2 JPH0810186 Y2 JP H0810186Y2
Authority
JP
Japan
Prior art keywords
adhesive tape
chip
mounting
heater block
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5927589U
Other languages
English (en)
Japanese (ja)
Other versions
JPH031432U (en]
Inventor
勉 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5927589U priority Critical patent/JPH0810186Y2/ja
Publication of JPH031432U publication Critical patent/JPH031432U/ja
Application granted granted Critical
Publication of JPH0810186Y2 publication Critical patent/JPH0810186Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP5927589U 1989-05-23 1989-05-23 チップマウント装置 Expired - Lifetime JPH0810186Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5927589U JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5927589U JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Publications (2)

Publication Number Publication Date
JPH031432U JPH031432U (en]) 1991-01-09
JPH0810186Y2 true JPH0810186Y2 (ja) 1996-03-27

Family

ID=31585627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5927589U Expired - Lifetime JPH0810186Y2 (ja) 1989-05-23 1989-05-23 チップマウント装置

Country Status (1)

Country Link
JP (1) JPH0810186Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077098A (ja) * 2009-09-29 2011-04-14 Disco Abrasive Syst Ltd ダイボンダ装置

Also Published As

Publication number Publication date
JPH031432U (en]) 1991-01-09

Similar Documents

Publication Publication Date Title
US5964030A (en) Mold flow regulating dam ring
JPH0810186Y2 (ja) チップマウント装置
JPH04326561A (ja) リードフレーム
US4790897A (en) Device for bonding of lead wires for an integrated circuit device
US5622304A (en) Tape bonding apparatus
US5080279A (en) Method for tape automated bonding
KR20240037854A (ko) 가열된 캐리어를 냉각하기 위한 냉각 스테이지
US5661090A (en) Process and apparatus for manufacturing ceramic semiconductor packages
US5391923A (en) Tape carrier including leads on both sides and resin-encapsulated semiconductor device incorporating the tape carrier
JP3920413B2 (ja) 実装装置及び実装方法
JPH0297033A (ja) ワイヤボンディング装置
US6698088B2 (en) Universal clamping mechanism
JPH056851U (ja) ヒートシンク
JPS5642669A (en) Thermal printer head
JPS53110371A (en) Ceramic package type semiconductor device
JPH02172248A (ja) テープキヤリア用ガイド装置
WO2002047451A2 (en) Conduited heat dissipation device
JPS6344997Y2 (en])
JPH0529788A (ja) 回路接続用のリードピンテーピング及びそれを用いたリードピンの取付方法
JPH0547465Y2 (en])
JPH10190211A (ja) 面実装形半導体パッケージの半田付装置及び半田付実装方法
JPH047102B2 (en])
JPS6228491U (en])
JPH0173995U (en])
JPS6151852A (ja) プリント基板およびその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term